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      • MPT/MTC/Thermal Chamber
      • MPT MTC Collaterals
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      • Test Interface Selection
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      • Advanced Package Qual
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  • Home
  • Products/Services
    • MPT/MTC/Thermal Chamber
    • MPT MTC Collaterals
    • Characterization Services
    • Trainings
  • Applications
    • Test Interface Developers
    • Test Interface Selection
    • Production Sites
    • Advanced Package Qual
  • Blog
  • Support
    • Apps Notes
    • ROI Calculator
    • SW-HW Release
    • TroubleShooting Guide
    • RMA Request
  • About Us
    • Company
    • Quality Policy
    • Holidays
    • Subscribe

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Modus Test delivers innovative and tailored test interface verification and characterization solutions, implementing the “known good socket” concept in production to achieve higher operational profits.  Modus Test solutions also provide unprecedented design verification tools to the test interface developers and semiconductor packaging developers.

Products by Application with known good socket

Modus Test has paved the way for system-level per-pin CRES measurements for sockets and various interconnect verification methods, including DSA checkers and test Interface boards. This enables the Known Good Socket/Interface process to maximize production capacity.  

 

Modus Test's high-density and high-accuracy parametric testers enabled advanced electrical testing for advanced package interconnects (bumps/TSVs) with the following benefits: 


  1. Package PDK development by running the package process corners 
  2. Process control and monitoring in production 
  3. 3D model verification for Package EDA companies 
  4. Failure correlation and early detection using extensive data collected for AI/ML analysis tools 

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Modus Test, LLC.

671 N. Plano Rd, Suite 201, Richardson, TX 75081

(972) 823-0037

Copyright © 2018 Modus Test, LLC. - All Rights Reserved.

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