Modus Test delivers innovative and tailored test interface verification and characterization solutions, implementing the “known good socket” concept in production to achieve higher operational profits.  Modus Test solutions also provide unprecedented design verification tools to the test interface developers and semiconductor packaging developers.

Modus Test has paved the way for system-level per-pin CRES measurements for sockets and various interconnect verification methods, including DSA checkers and test Interface boards. This enables the Known Good Socket/Interface process to maximize production capacity.  

Modus Test's high-density and high-accuracy parametric testers enabled advanced electrical testing for advanced package interconnects (bumps/TSVs) with the following benefits: 

1. Package PDK development by running the package process corners 
2. Process control and monitoring in production 
3. 3D model verification for Package EDA companies 
4. Failure correlation and early detection using extensive data collected for AI/ML analysis tools